From d6fabead748c80e2dd5e2ec55b55e01daed1f3c3 Mon Sep 17 00:00:00 2001
From: LAPTOP-SNT8I5JK\Boounion <Chenluhua@qq.com>
Date: 星期二, 09 九月 2025 11:37:50 +0800
Subject: [PATCH] 1.修改Bonder的SVData数据解释，其中一项压力有符号，增加一个加热剩余时间； 2.SVData解释偏移错误修复
---
SourceCode/Bond/BondEq/BondEq.cpp | 11 +++++++++++
1 files changed, 11 insertions(+), 0 deletions(-)
diff --git a/SourceCode/Bond/BondEq/BondEq.cpp b/SourceCode/Bond/BondEq/BondEq.cpp
index 6818a3d..984e455 100644
--- a/SourceCode/Bond/BondEq/BondEq.cpp
+++ b/SourceCode/Bond/BondEq/BondEq.cpp
@@ -77,6 +77,11 @@
SetRegistryKey(_T("应用程序向导生成的本地应用程序"));
+ // gdi+
+ Gdiplus::GdiplusStartupInput gdiplusStartupInput;
+ Gdiplus::GdiplusStartup(&m_gdiplusToken, &gdiplusStartupInput, NULL);
+
+
// 本程序文件目录
TCHAR sDrive[_MAX_DRIVE];
TCHAR sDir[_MAX_DIR];
@@ -156,6 +161,12 @@
BEQ_Term();
RX_Term();
MCL_Term();
+ CloseHandle(m_hAppMutex);
+
+
+ // gdi+
+ Gdiplus::GdiplusShutdown(m_gdiplusToken);
+
return CWinApp::ExitInstance();
}
--
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