From cbe189228810812547d16a3211ab0b174831f609 Mon Sep 17 00:00:00 2001
From: LAPTOP-SNT8I5JK\Boounion <Chenluhua@qq.com>
Date: 星期一, 24 三月 2025 11:56:04 +0800
Subject: [PATCH] 1.修复一个闪退问题(Glass列表为空仍要下传导致)； 2.在CEquipment派生类中实现限制上游移动（如下在加工且加工数量有限制）；

---
 SourceCode/Bond/BondEq/CPLC.h |    1 +
 1 files changed, 1 insertions(+), 0 deletions(-)

diff --git a/SourceCode/Bond/BondEq/CPLC.h b/SourceCode/Bond/BondEq/CPLC.h
index 89fded1..f65d324 100644
--- a/SourceCode/Bond/BondEq/CPLC.h
+++ b/SourceCode/Bond/BondEq/CPLC.h
@@ -58,6 +58,7 @@
 	int readWord(MC::SOFT_COMPONENT softComponent, unsigned int addr, ONREAD funOnRead);
 	int readData(MC::SOFT_COMPONENT softComponent, unsigned int addr, unsigned int nReadLen, ONREADDATA funOnReadData);
 	int writeWord(MC::SOFT_COMPONENT softComponent, unsigned int addr, int value, ONWRITE funOnWrite);
+	int writeDWord(MC::SOFT_COMPONENT softComponent, unsigned int addr, int value, ONWRITE funOnWrite);
 	int writeBit(MC::SOFT_COMPONENT softComponent, unsigned int addr, BOOL bValue, ONWRITE funOnWrite);
 	int writeData(MC::SOFT_COMPONENT softComponent, unsigned int addr, const char* pszData, unsigned int length, ONWRITE funOnWrite);
 

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