From a1bf060d50da3c27b54bcc349e8b53769b39ef89 Mon Sep 17 00:00:00 2001
From: LAPTOP-SNT8I5JK\Boounion <Chenluhua@qq.com>
Date: 星期二, 03 六月 2025 17:31:33 +0800
Subject: [PATCH] 1.增加Aligner --> Bonder1 | Bonder2的搬送检测逻辑； 2.优化搬送逻辑。搬送要分优先考虑的主类型和次要类型。一种情况，如果不分主次，一直搬G1, 等到Bonder1和Bonder2都放了G1, Aligner也放了G1, Bonder1和Bonder2需要的G2就过不来了（在Aligner阻塞了）。另外从生产效率上来说，也应该根据需求，尽快使其中一台Bonder的两片玻璃匹配以使其能尽快开始生产加工。

---
 SourceCode/Bond/x64/Release/configuration.ini |    9 +++++++++
 1 files changed, 9 insertions(+), 0 deletions(-)

diff --git a/SourceCode/Bond/x64/Release/configuration.ini b/SourceCode/Bond/x64/Release/configuration.ini
index 1d3f0e0..805d7bc 100644
--- a/SourceCode/Bond/x64/Release/configuration.ini
+++ b/SourceCode/Bond/x64/Release/configuration.ini
@@ -120,3 +120,12 @@
 Col_0_Width=0
 Col_1_Width=222
 Col_2_Width=1137
+[AlarmListCtrl]
+Col_0_Width=0
+Col_1_Width=80
+Col_2_Width=180
+Col_3_Width=80
+Col_4_Width=80
+Col_5_Width=100
+Col_6_Width=80
+Col_7_Width=248

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