From a1bf060d50da3c27b54bcc349e8b53769b39ef89 Mon Sep 17 00:00:00 2001
From: LAPTOP-SNT8I5JK\Boounion <Chenluhua@qq.com>
Date: 星期二, 03 六月 2025 17:31:33 +0800
Subject: [PATCH] 1.增加Aligner --> Bonder1 | Bonder2的搬送检测逻辑； 2.优化搬送逻辑。搬送要分优先考虑的主类型和次要类型。一种情况，如果不分主次，一直搬G1, 等到Bonder1和Bonder2都放了G1, Aligner也放了G1, Bonder1和Bonder2需要的G2就过不来了（在Aligner阻塞了）。另外从生产效率上来说，也应该根据需求，尽快使其中一台Bonder的两片玻璃匹配以使其能尽快开始生产加工。

---
 SourceCode/Bond/Servo/CPanelEquipment.h |    2 ++
 1 files changed, 2 insertions(+), 0 deletions(-)

diff --git a/SourceCode/Bond/Servo/CPanelEquipment.h b/SourceCode/Bond/Servo/CPanelEquipment.h
index 460e858..9aa3580 100644
--- a/SourceCode/Bond/Servo/CPanelEquipment.h
+++ b/SourceCode/Bond/Servo/CPanelEquipment.h
@@ -14,11 +14,13 @@
 	virtual ~CPanelEquipment();
 	int getPanelWidth();
 	void SetEquipment(SERVO::CEquipment* pEquipment);
+	void loadDataFromEquipment(SERVO::CEquipment* pEquipment);
 
 private:
 	COLORREF m_crBkgnd;
 	HBRUSH m_hbrBkgnd;
 	int m_nPanelWidth;
+	CMFCPropertyGridCtrl m_gridCtrl;
 	CBlButton m_btnClose;
 	SERVO::CEquipment* m_pEquipment;
 

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