From a1bf060d50da3c27b54bcc349e8b53769b39ef89 Mon Sep 17 00:00:00 2001
From: LAPTOP-SNT8I5JK\Boounion <Chenluhua@qq.com>
Date: 星期二, 03 六月 2025 17:31:33 +0800
Subject: [PATCH] 1.增加Aligner --> Bonder1 | Bonder2的搬送检测逻辑； 2.优化搬送逻辑。搬送要分优先考虑的主类型和次要类型。一种情况，如果不分主次，一直搬G1, 等到Bonder1和Bonder2都放了G1, Aligner也放了G1, Bonder1和Bonder2需要的G2就过不来了（在Aligner阻塞了）。另外从生产效率上来说，也应该根据需求，尽快使其中一台Bonder的两片玻璃匹配以使其能尽快开始生产加工。
---
SourceCode/Bond/Servo/CCLinkPerformance/CCLinkIEControl.h | 2 +-
1 files changed, 1 insertions(+), 1 deletions(-)
diff --git a/SourceCode/Bond/Servo/CCLinkPerformance/CCLinkIEControl.h b/SourceCode/Bond/Servo/CCLinkPerformance/CCLinkIEControl.h
index 5d92f9e..60f4e7d 100644
--- a/SourceCode/Bond/Servo/CCLinkPerformance/CCLinkIEControl.h
+++ b/SourceCode/Bond/Servo/CCLinkPerformance/CCLinkIEControl.h
@@ -59,7 +59,7 @@
// 读取LED状态
int ReadLedStatus(LedStatus& outLedStatus);
- int ReadData2(const StationIdentifier& station, DeviceType enDevType, short devNo, short size, void* pData);
+ int ReadData2(const StationIdentifier& station, DeviceType enDevType, long devNo, long size, void* pData);
private:
static CCLinkIEControlMode ConvertToCCLinkIEControlMode(short nMode);
--
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