From a1bf060d50da3c27b54bcc349e8b53769b39ef89 Mon Sep 17 00:00:00 2001
From: LAPTOP-SNT8I5JK\Boounion <Chenluhua@qq.com>
Date: 星期二, 03 六月 2025 17:31:33 +0800
Subject: [PATCH] 1.增加Aligner --> Bonder1 | Bonder2的搬送检测逻辑; 2.优化搬送逻辑。搬送要分优先考虑的主类型和次要类型。一种情况,如果不分主次,一直搬G1, 等到Bonder1和Bonder2都放了G1, Aligner也放了G1, Bonder1和Bonder2需要的G2就过不来了(在Aligner阻塞了)。另外从生产效率上来说,也应该根据需求,尽快使其中一台Bonder的两片玻璃匹配以使其能尽快开始生产加工。

---
 SourceCode/Bond/BondEq/FileManager/IOManager.h |    2 ++
 1 files changed, 2 insertions(+), 0 deletions(-)

diff --git a/SourceCode/Bond/BondEq/FileManager/IOManager.h b/SourceCode/Bond/BondEq/FileManager/IOManager.h
index 9d81cd3..8751052 100644
--- a/SourceCode/Bond/BondEq/FileManager/IOManager.h
+++ b/SourceCode/Bond/BondEq/FileManager/IOManager.h
@@ -6,8 +6,10 @@
 #include <map>
 
 struct IOData {
+	BOOL bInputStates;
     std::string inputAddress;
     std::string inputDescription;
+    BOOL bOutputStates;
     std::string outputAddress;
     std::string outputDescription;
 };

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