From 96579a48b3b558f5ce58cffe372b1f563a9e62ce Mon Sep 17 00:00:00 2001
From: LAPTOP-SNT8I5JK\Boounion <Chenluhua@qq.com>
Date: 星期三, 03 九月 2025 17:23:56 +0800
Subject: [PATCH] 1.配方列表和配方参数获取合并在线程中获取，并更新状态到对话框； 2.配方参数获取； 3.Bonder, AOI, 真空烘烤, 冷却烧烤配方参数解释。

---
 SourceCode/Bond/HSMSSDK/Include/ISECS2Item.h |    2 ++
 1 files changed, 2 insertions(+), 0 deletions(-)

diff --git a/SourceCode/Bond/HSMSSDK/Include/ISECS2Item.h b/SourceCode/Bond/HSMSSDK/Include/ISECS2Item.h
index ba3f21d..09b9ed0 100644
--- a/SourceCode/Bond/HSMSSDK/Include/ISECS2Item.h
+++ b/SourceCode/Bond/HSMSSDK/Include/ISECS2Item.h
@@ -69,5 +69,7 @@
 	virtual ISECS2Item* addU1Item(unsigned char value, const char* pszNote) = 0;
 	virtual void setBinary(const char* pszData, unsigned int len, const char* pszNote) = 0;
 	virtual void setString(const char* pszText, const char* pszNote) = 0;
+	virtual void setU1(unsigned char value, const char* pszNote) = 0;
+	virtual void setBool(bool value, const char* pszNote) = 0;
 	virtual ISECS2Item* addItem() = 0;
 };

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