From 96579a48b3b558f5ce58cffe372b1f563a9e62ce Mon Sep 17 00:00:00 2001
From: LAPTOP-SNT8I5JK\Boounion <Chenluhua@qq.com>
Date: 星期三, 03 九月 2025 17:23:56 +0800
Subject: [PATCH] 1.配方列表和配方参数获取合并在线程中获取，并更新状态到对话框； 2.配方参数获取； 3.Bonder, AOI, 真空烘烤, 冷却烧烤配方参数解释。

---
 SourceCode/Bond/EAPSimulator/EAPSimulator.h |    8 ++++++++
 1 files changed, 8 insertions(+), 0 deletions(-)

diff --git a/SourceCode/Bond/EAPSimulator/EAPSimulator.h b/SourceCode/Bond/EAPSimulator/EAPSimulator.h
index 16755ad..0734c5a 100644
--- a/SourceCode/Bond/EAPSimulator/EAPSimulator.h
+++ b/SourceCode/Bond/EAPSimulator/EAPSimulator.h
@@ -9,6 +9,7 @@
 #endif
 
 #include "resource.h"		// 涓荤鍙�
+#include "CModel.h"
 
 
 // CEAPSimulatorApp:
@@ -20,6 +21,12 @@
 public:
 	CEAPSimulatorApp();
 
+
+public:
+	CModel m_model;
+	CString m_strAppDir;
+	CString m_strAppFile;
+
 // 閲嶅啓
 public:
 	virtual BOOL InitInstance();
@@ -27,6 +34,7 @@
 // 瀹炵幇
 
 	DECLARE_MESSAGE_MAP()
+	virtual int ExitInstance();
 };
 
 extern CEAPSimulatorApp theApp;

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