From 96579a48b3b558f5ce58cffe372b1f563a9e62ce Mon Sep 17 00:00:00 2001
From: LAPTOP-SNT8I5JK\Boounion <Chenluhua@qq.com>
Date: 星期三, 03 九月 2025 17:23:56 +0800
Subject: [PATCH] 1.配方列表和配方参数获取合并在线程中获取，并更新状态到对话框； 2.配方参数获取； 3.Bonder, AOI, 真空烘烤, 冷却烧烤配方参数解释。

---
 SourceCode/Bond/BondEq/Model.h |    2 ++
 1 files changed, 2 insertions(+), 0 deletions(-)

diff --git a/SourceCode/Bond/BondEq/Model.h b/SourceCode/Bond/BondEq/Model.h
index 1d243a3..58bb762 100644
--- a/SourceCode/Bond/BondEq/Model.h
+++ b/SourceCode/Bond/BondEq/Model.h
@@ -27,6 +27,8 @@
 	int notifyObjAndPtr(int code, IRxObject* pObj, void* ptr);
 	int notifyObjAndInt(int code, IRxObject* pObj1, IRxObject* pObj2, int exCode);
 	int notifyInt(int code, int exCode);
+	int notifyInt2(int code, int exCode, int exCode2);
+	int notifyDouble(int code, double dValue);
 	int notifyText(int code, const char* pszText);
 	int notifyPtrAndInt(int code, void* ptr1, void* ptr2, int exCode);
 	int notifyTextAndInt(int code, const char* pszText, int exCode);

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