From 96579a48b3b558f5ce58cffe372b1f563a9e62ce Mon Sep 17 00:00:00 2001
From: LAPTOP-SNT8I5JK\Boounion <Chenluhua@qq.com>
Date: 星期三, 03 九月 2025 17:23:56 +0800
Subject: [PATCH] 1.配方列表和配方参数获取合并在线程中获取，并更新状态到对话框； 2.配方参数获取； 3.Bonder, AOI, 真空烘烤, 冷却烧烤配方参数解释。
---
SourceCode/Bond/BondEq/Component.h | 4 +++-
1 files changed, 3 insertions(+), 1 deletions(-)
diff --git a/SourceCode/Bond/BondEq/Component.h b/SourceCode/Bond/BondEq/Component.h
index 46e43c3..8b239a3 100644
--- a/SourceCode/Bond/BondEq/Component.h
+++ b/SourceCode/Bond/BondEq/Component.h
@@ -38,9 +38,11 @@
int WriteData(MC::SOFT_COMPONENT softComponent, unsigned int addr,
const char* pszData, unsigned int length, ONWRITE funOnWrite);
-protected:
+public:
inline void Lock() { EnterCriticalSection(&m_criticalSection); }
inline void Unlock() { LeaveCriticalSection(&m_criticalSection); }
+
+protected:
void SendBroadcast(CIntent* pIntent);
protected:
--
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