From 96579a48b3b558f5ce58cffe372b1f563a9e62ce Mon Sep 17 00:00:00 2001
From: LAPTOP-SNT8I5JK\Boounion <Chenluhua@qq.com>
Date: 星期三, 03 九月 2025 17:23:56 +0800
Subject: [PATCH] 1.配方列表和配方参数获取合并在线程中获取，并更新状态到对话框； 2.配方参数获取； 3.Bonder, AOI, 真空烘烤, 冷却烧烤配方参数解释。

---
 SourceCode/Bond/BondEq/CComponentPLCDlg.h |    4 ++++
 1 files changed, 4 insertions(+), 0 deletions(-)

diff --git a/SourceCode/Bond/BondEq/CComponentPLCDlg.h b/SourceCode/Bond/BondEq/CComponentPLCDlg.h
index b39ac8e..484fa14 100644
--- a/SourceCode/Bond/BondEq/CComponentPLCDlg.h
+++ b/SourceCode/Bond/BondEq/CComponentPLCDlg.h
@@ -15,6 +15,7 @@
 
 private:
 	void InitRxWindows();
+	void EnableGroup1(BOOL bEnable);
 
 private:
 	IObserver* m_pObserver;
@@ -34,4 +35,7 @@
 	afx_msg HBRUSH OnCtlColor(CDC* pDC, CWnd* pWnd, UINT nCtlColor);
 	afx_msg void OnDestroy();
 	afx_msg void OnSize(UINT nType, int cx, int cy);
+	afx_msg void OnBnClickedButtonAxisSetting();
+	afx_msg void OnBnClickedButtonIO();
+	afx_msg void OnTimer(UINT_PTR nIDEvent);
 };

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