From 96579a48b3b558f5ce58cffe372b1f563a9e62ce Mon Sep 17 00:00:00 2001
From: LAPTOP-SNT8I5JK\Boounion <Chenluhua@qq.com>
Date: 星期三, 03 九月 2025 17:23:56 +0800
Subject: [PATCH] 1.配方列表和配方参数获取合并在线程中获取，并更新状态到对话框； 2.配方参数获取； 3.Bonder, AOI, 真空烘烤, 冷却烧烤配方参数解释。
---
SourceCode/Bond/BondEq/BondEq.cpp | 12 ++++++++++++
1 files changed, 12 insertions(+), 0 deletions(-)
diff --git a/SourceCode/Bond/BondEq/BondEq.cpp b/SourceCode/Bond/BondEq/BondEq.cpp
index 7366fa1..984e455 100644
--- a/SourceCode/Bond/BondEq/BondEq.cpp
+++ b/SourceCode/Bond/BondEq/BondEq.cpp
@@ -77,6 +77,11 @@
SetRegistryKey(_T("应用程序向导生成的本地应用程序"));
+ // gdi+
+ Gdiplus::GdiplusStartupInput gdiplusStartupInput;
+ Gdiplus::GdiplusStartup(&m_gdiplusToken, &gdiplusStartupInput, NULL);
+
+
// 本程序文件目录
TCHAR sDrive[_MAX_DRIVE];
TCHAR sDir[_MAX_DIR];
@@ -152,9 +157,16 @@
int CBondEqApp::ExitInstance()
{
+ m_model.term();
BEQ_Term();
RX_Term();
MCL_Term();
+ CloseHandle(m_hAppMutex);
+
+
+ // gdi+
+ Gdiplus::GdiplusShutdown(m_gdiplusToken);
+
return CWinApp::ExitInstance();
}
--
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