From 6708de638614ace717045551552b745e015c0864 Mon Sep 17 00:00:00 2001
From: mrDarker <mr.darker@163.com>
Date: 星期四, 17 七月 2025 14:01:50 +0800
Subject: [PATCH] 1. 补全真空烘烤的腔体 2. 补全冷却的读取信号

---
 SourceCode/Bond/BondEq/Model.h |    2 ++
 1 files changed, 2 insertions(+), 0 deletions(-)

diff --git a/SourceCode/Bond/BondEq/Model.h b/SourceCode/Bond/BondEq/Model.h
index 1d243a3..58bb762 100644
--- a/SourceCode/Bond/BondEq/Model.h
+++ b/SourceCode/Bond/BondEq/Model.h
@@ -27,6 +27,8 @@
 	int notifyObjAndPtr(int code, IRxObject* pObj, void* ptr);
 	int notifyObjAndInt(int code, IRxObject* pObj1, IRxObject* pObj2, int exCode);
 	int notifyInt(int code, int exCode);
+	int notifyInt2(int code, int exCode, int exCode2);
+	int notifyDouble(int code, double dValue);
 	int notifyText(int code, const char* pszText);
 	int notifyPtrAndInt(int code, void* ptr1, void* ptr2, int exCode);
 	int notifyTextAndInt(int code, const char* pszText, int exCode);

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