From 35199ad4aaa3f35ff82da77d7108a4e9f136443e Mon Sep 17 00:00:00 2001
From: LAPTOP-T815PCOQ\25526 <mr.liuyang@126.com>
Date: 星期五, 06 十二月 2024 17:49:56 +0800
Subject: [PATCH] 1.修改配方管理模块，定位点等参数有最大值最小值 2.同步修改合并轴管理界面3.IO界面显示16个，16个为一组
---
SourceCode/Bond/BondEq/CPLC.cpp | 6 ++++++
1 files changed, 6 insertions(+), 0 deletions(-)
diff --git a/SourceCode/Bond/BondEq/CPLC.cpp b/SourceCode/Bond/BondEq/CPLC.cpp
index ba307d3..3c4d175 100644
--- a/SourceCode/Bond/BondEq/CPLC.cpp
+++ b/SourceCode/Bond/BondEq/CPLC.cpp
@@ -269,6 +269,12 @@
return m_pChannel->writeWord(softComponent, addr, value, funOnWrite);
}
+int CPLC::writeDWord(MC::SOFT_COMPONENT softComponent, unsigned int addr,
+ int value, ONWRITE funOnWrite)
+{
+ return m_pChannel->writeDWord(softComponent, addr, value, funOnWrite);
+}
+
int CPLC::writeData(MC::SOFT_COMPONENT softComponent, unsigned int addr,
const char* pszData, unsigned int length, ONWRITE funOnWrite)
{
--
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