From 35199ad4aaa3f35ff82da77d7108a4e9f136443e Mon Sep 17 00:00:00 2001
From: LAPTOP-T815PCOQ\25526 <mr.liuyang@126.com>
Date: 星期五, 06 十二月 2024 17:49:56 +0800
Subject: [PATCH] 1.修改配方管理模块，定位点等参数有最大值最小值 2.同步修改合并轴管理界面3.IO界面显示16个，16个为一组

---
 SourceCode/Bond/BondEq/CComponentPLCDlg.h |    4 ++++
 1 files changed, 4 insertions(+), 0 deletions(-)

diff --git a/SourceCode/Bond/BondEq/CComponentPLCDlg.h b/SourceCode/Bond/BondEq/CComponentPLCDlg.h
index b39ac8e..484fa14 100644
--- a/SourceCode/Bond/BondEq/CComponentPLCDlg.h
+++ b/SourceCode/Bond/BondEq/CComponentPLCDlg.h
@@ -15,6 +15,7 @@
 
 private:
 	void InitRxWindows();
+	void EnableGroup1(BOOL bEnable);
 
 private:
 	IObserver* m_pObserver;
@@ -34,4 +35,7 @@
 	afx_msg HBRUSH OnCtlColor(CDC* pDC, CWnd* pWnd, UINT nCtlColor);
 	afx_msg void OnDestroy();
 	afx_msg void OnSize(UINT nType, int cx, int cy);
+	afx_msg void OnBnClickedButtonAxisSetting();
+	afx_msg void OnBnClickedButtonIO();
+	afx_msg void OnTimer(UINT_PTR nIDEvent);
 };

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