From 35199ad4aaa3f35ff82da77d7108a4e9f136443e Mon Sep 17 00:00:00 2001
From: LAPTOP-T815PCOQ\25526 <mr.liuyang@126.com>
Date: 星期五, 06 十二月 2024 17:49:56 +0800
Subject: [PATCH] 1.修改配方管理模块，定位点等参数有最大值最小值 2.同步修改合并轴管理界面3.IO界面显示16个，16个为一组
---
SourceCode/Bond/BondEq/BondEqDlg.cpp | 3 ++-
1 files changed, 2 insertions(+), 1 deletions(-)
diff --git a/SourceCode/Bond/BondEq/BondEqDlg.cpp b/SourceCode/Bond/BondEq/BondEqDlg.cpp
index 3584094..498f7af 100644
--- a/SourceCode/Bond/BondEq/BondEqDlg.cpp
+++ b/SourceCode/Bond/BondEq/BondEqDlg.cpp
@@ -760,8 +760,9 @@
CComponentPLCDlg* CBondEqDlg::CreateComponentPLCDlg(CComponent* pComponent)
{
CComponentPLCDlg* pDlg = new CComponentPLCDlg(m_pMainContainer);
- pDlg->Create(IDD_COMPONENT_PLC, m_pMainContainer);
pDlg->SetContext(pComponent);
+ pDlg->Create(IDD_COMPONENT_PLC, m_pMainContainer);
+
CString strIcon0, strIcon1, strIcon2, strIcon3;
strIcon0.Format(_T("%s\\Res\\small_close0.ico"), (LPTSTR)(LPCTSTR)theApp.m_strAppDir);
--
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