From 35199ad4aaa3f35ff82da77d7108a4e9f136443e Mon Sep 17 00:00:00 2001
From: LAPTOP-T815PCOQ\25526 <mr.liuyang@126.com>
Date: 星期五, 06 十二月 2024 17:49:56 +0800
Subject: [PATCH] 1.修改配方管理模块，定位点等参数有最大值最小值 2.同步修改合并轴管理界面3.IO界面显示16个，16个为一组
---
SourceCode/Bond/BondEq/BondEq.cpp | 1 +
1 files changed, 1 insertions(+), 0 deletions(-)
diff --git a/SourceCode/Bond/BondEq/BondEq.cpp b/SourceCode/Bond/BondEq/BondEq.cpp
index 7366fa1..6818a3d 100644
--- a/SourceCode/Bond/BondEq/BondEq.cpp
+++ b/SourceCode/Bond/BondEq/BondEq.cpp
@@ -152,6 +152,7 @@
int CBondEqApp::ExitInstance()
{
+ m_model.term();
BEQ_Term();
RX_Term();
MCL_Term();
--
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